Semiconductor Manufacturing Equipment Market Share, Forecast & Analysis Report, By Front-End Equipment (Lithography, Wafer Surface Conditioning, Deposition, Cleaning, and Others), By Back-End Equipment (Assembly and Packaging, Dicing, Bonding, Metrology, and Testing), By Product (Memory, Foundry, Logic, MPU, Discrete, Analog, MEMS, and Others), and By Region – Global Opportunities & Forecast, 2020-2027
1. Executive Summary
1.1. Key Market Insights
2. Introduction
2.1. Study Objectives
2.2. Market Definition
2.2.1. Market Covered
2.2.2. Regional Coverage
2.2.3. Study Years & Currency
2.3. Market Stakeholders
2.4. Key Questions this Study will Answer
2.5. GMI Research’s Approach & Methodology
2.5.1. Research D.ata
2.5.2. Primary Data
2.5.3. Demand Side and Supply Side Analysis
2.5.4. Market Size Estimation
2.5.5. Research Assumptions
3. Global Semiconductor Manufacturing Equipment Market- Overview
3.1. Introduction
3.2. Market Segmentation
3.3. Value Chain Analysis
3.4. Market Drivers
3.5. Market Restraints
3.6. Market Trends
4. Global Semiconductor Manufacturing Equipment Market Revenue Forecast till 2027
5. Global Semiconductor Manufacturing Equipment Market by Front-End Equipment Revenue Forecast till 2027
5.1. Lithography
5.2. Wafer Surface Conditioning
5.3. Deposition
5.4. Cleaning
5.5. Others
6. Global Semiconductor Manufacturing Equipment Market by Back-End Equipment Revenue Forecast till 2027
6.1. Assembly and Packaging
6.2. Dicing
6.3. Bonding
6.4. Metrology
6.5. Testing
7. Global Semiconductor Manufacturing Equipment Market by Product Revenue Forecast till 2027
7.1. Memory
7.2. Foundry
7.3. Logic
7.4. MPU
7.5. Discrete
7.6. Analog
7.7. MEMS
7.8. Other
8. Global Semiconductor Manufacturing Equipment Market by Region Forecast till 2027
8.1. North America Semiconductor Manufacturing Equipment Market Revenue Forecast till 2027
(Option 1: As a part of the free 25% customization)
8.1.1. North America Semiconductor Manufacturing Equipment Market by Front-End Equipment
8.1.1.1. Lithography
8.1.1.2. Wafer Surface Conditioning
8.1.1.3. Deposition
8.1.1.4. Cleaning
8.1.1.5. Others
8.1.2. North America Semiconductor Manufacturing Equipment Market by Back-End Equipment
8.1.2.1. Assembly and Packaging
8.1.2.2. Dicing
8.1.2.3. Bonding
8.1.2.4. Metrology
8.1.2.5. Testing
8.1.3. North America Semiconductor Manufacturing Equipment Market by Product
8.1.3.1. Memory
8.1.3.2. Foundry
8.1.3.3. Logic
8.1.3.4. MPU
8.1.3.5. Discrete
8.1.3.6. Analog
8.1.3.7. MEMS
8.1.3.8. Other
8.1.4. United States of America (US) Semiconductor Manufacturing Equipment Market All-Up
8.1.5. Canada Semiconductor Manufacturing Equipment Market All-Up
8.2. Europe Semiconductor Manufacturing Equipment Market Revenue Forecast till 2027
(Option 2: As a part of the free 25% customization)
8.2.1. Europe Semiconductor Manufacturing Equipment Market by Front-End Equipment
8.2.1.1. Lithography
8.2.1.2. Wafer Surface Conditioning
8.2.1.3. Deposition
8.2.1.4. Cleaning
8.2.1.5. Others
8.2.2. Europe Semiconductor Manufacturing Equipment Market by Back-End Equipment
8.2.2.1. Assembly and Packaging
8.2.2.2. Dicing
8.2.2.3. Bonding
8.2.2.4. Metrology
8.2.2.5. Testing
8.2.3. Europe Semiconductor Manufacturing Equipment Market by Product
8.2.3.1. Memory
8.2.3.2. Foundry
8.2.3.3. Logic
8.2.3.4. MPU
8.2.3.5. Discrete
8.2.3.6. Analog
8.2.3.7. MEMS
8.2.3.8. Other
8.2.4. United Kingdom (UK) Semiconductor Manufacturing Equipment Market All-Up
8.2.5. Germany Semiconductor Manufacturing Equipment Market All-Up
8.2.6. France Semiconductor Manufacturing Equipment Market All-Up
8.2.7. Spain Semiconductor Manufacturing Equipment Market All-Up
8.2.8. Rest of Europe Semiconductor Manufacturing Equipment Market All-Up
8.3. Asia-Pacific Semiconductor Manufacturing Equipment Market Revenue Forecast till 2027
(Option 3: As a part of the free 25% customization)
8.3.1. Asia-Pacific Semiconductor Manufacturing Equipment Market by Front-End Equipment
8.3.1.1. Lithography
8.3.1.2. Wafer Surface Conditioning
8.3.1.3. Deposition
8.3.1.4. Cleaning
8.3.1.5. Others
8.3.2. Asia-Pacific Semiconductor Manufacturing Equipment Market by Back-End Equipment
8.3.2.1. Assembly and Packaging
8.3.2.2. Dicing
8.3.2.3. Bonding
8.3.2.4. Metrology
8.3.2.5. Testing
8.3.3. Asia-Pacific Semiconductor Manufacturing Equipment Market by Product
8.3.3.1. Memory
8.3.3.2. Foundry
8.3.3.3. Logic
8.3.3.4. MPU
8.3.3.5. Discrete
8.3.3.6. Analog
8.3.3.7. MEMS
8.3.3.8. Other
8.3.4. China Semiconductor Manufacturing Equipment Market All-Up
8.3.5. India Semiconductor Manufacturing Equipment Market All-Up
8.3.6. Japan Semiconductor Manufacturing Equipment Market All-Up
8.3.7. Rest of APAC Semiconductor Manufacturing Equipment Market All-Up
8.4. RoW Semiconductor Manufacturing Equipment Market Revenue Forecast till 2027
(Option 4: As a part of the free 25% customization)
8.4.1. RoW Semiconductor Manufacturing Equipment Market by Front-End Equipment
8.4.1.1. Lithography
8.4.1.2. Wafer Surface Conditioning
8.4.1.3. Deposition
8.4.1.4. Cleaning
8.4.1.5. Others
8.4.2. RoW Semiconductor Manufacturing Equipment Market by Back-End Equipment
8.4.2.1. Assembly and Packaging
8.4.2.2. Dicing
8.4.2.3. Bonding
8.4.2.4. Metrology
8.4.2.5. Testing
8.4.3. RoW Semiconductor Manufacturing Equipment Market by Product
8.4.3.1. Memory
8.4.3.2. Foundry
8.4.3.3. Logic
8.4.3.4. MPU
8.4.3.5. Discrete
8.4.3.6. Analog
8.4.3.7. MEMS
8.4.3.8. Other
8.4.4. Brazil Semiconductor Manufacturing Equipment Market All-Up
8.4.5. South Africa Semiconductor Manufacturing Equipment Market All-Up
8.4.6. Saudi Arabia Semiconductor Manufacturing Equipment Market All-Up
8.4.7. UAE Semiconductor Manufacturing Equipment Market All-Up
8.4.8. Rest of world (remaining countries of the LAMEA region) Semiconductor Manufacturing Equipment Market All-Up
9. Competitive Landscape Analysis
9.1. Porter’s Five Forces Analysis
9.2. Industry – Competitive Landscape
9.3. Market Presence (Intensity Mapping)
9.4. Key Strategic Market Developments
10. Company Profiles (Option 5: Free 25% Customization - Profiles of 5 Additional Companies of your Choice)
10.1. STMicroelectronics N.V.
10.1.1. Company Overview
10.1.2. Key Executives
10.1.3. Footprint & Employee Strength
10.1.4. Product Offerings
10.1.5. Financials
10.1.6. Key Company Developments
10.2. Taiwan Semiconductor Manufacturing Company Limited
10.2.1. Company Overview
10.2.2. Key Executives
10.2.3. Footprint & Employee Strength
10.2.4. Product Offerings
10.2.5. Financials
10.2.6. Key Company Developments
10.3. Tokyo Electron Limited
10.3.1. Company Overview
10.3.2. Key Executives
10.3.3. Footprint & Employee Strength
10.3.4. Product Offerings
10.3.5. Financials
10.3.6. Key Company Developments
10.4. LAM Research Corporation
10.4.1. Company Overview
10.4.2. Key Executives
10.4.3. Footprint & Employee Strength
10.4.4. Product Offerings
10.4.5. Financials
10.4.6. Key Company Developments
10.5. ASML Holding N.V.
10.5.1. Company Overview
10.5.2. Key Executives
10.5.3. Footprint & Employee Strength
10.5.4. Product Offerings
10.5.5. Financials
10.5.6. Key Company Developments
10.6. Applied Materials, Inc.
10.6.1. Company Overview
10.6.2. Key Executives
10.6.3. Footprint & Employee Strength
10.6.4. Product Offerings
10.6.5. Financials
10.6.6. Key Company Developments
10.7. KLA Corporation
10.7.1. Company Overview
10.7.2. Key Executives
10.7.3. Footprint & Employee Strength
10.7.4. Product Offerings
10.7.5. Financials
10.7.6. Key Company Developments
10.8. SCREEN Holdings Co., Ltd.
10.8.1. Company Overview
10.8.2. Key Executives
10.8.3. Footprint & Employee Strength
10.8.4. Product Offerings
10.8.5. Financials
10.8.6. Key Company Developments
10.9. Teradyne Inc.
10.9.1. Company Overview
10.9.2. Key Executives
10.9.3. Footprint & Employee Strength
10.9.4. Product Offerings
10.9.5. Financials
10.9.6. Key Company Developments
10.10. Advantest Corporation
10.10.1. Company Overview
10.10.2. Key Executives
10.10.3. Footprint & Employee Strength
10.10.4. Product Offerings
10.10.5. Financials
10.10.6. Key Company Developments
11. About GMI Research
*Details on Financials might not be available in case of unlisted/private companies.
*The list of companies is based on preliminary research in this report, the companies in the final report may change based on research findings.
- Published Date: Apr - 2021
- Report Format: Excel/PPT
- Report Code: UP2060-001001
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The report is used by the purchaser (One Individual) only
Multi-User License:Report is shared with maximum 5 users (employees) including the purchaser of the purchasing corporation only
Corporate License:
Report is shared with unlimited user (employees) of the purchasing corporation only
Semiconductor Manufacturing Equipment Market Share, Forecast & Analysis Report, By Front-End Equipment (Lithography, Wafer Surface Conditioning, Deposition, Cleaning, and Others), By Back-End Equipment (Assembly and Packaging, Dicing, Bonding, Metrology, and Testing), By Product (Memory, Foundry, Logic, MPU, Discrete, Analog, MEMS, and Others), and By Region – Global Opportunities & Forecast, 2020-2027
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